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| Transistor 2SB0789, 2SB0789A (2SB789, 2SB789A) Silicon PNP epitaxial planar type For low-frequency driver amplification Complementary to 2SD0968 (2SD968) and 2SD0968A (2SD968A) 4.50.1 Unit: mm s q q Features High collector to emitter voltage VCEO. Large collector power dissipation PC. (Ta=25C) Ratings -100 -120 -100 -120 -5 -1 -0.5 1 150 -55 ~ +150 Unit V 1 0.40.08 1.50.1 3 1.60.2 1.50.1 4.0+0.25 -0.20 2.50.1 3 1.0+0.1 -0.2 s Absolute Maximum Ratings Parameter Collector to base voltage Collector to 2SB0789 2SB0789A 2SB0789 VCBO VCEO VEBO ICP IC PC* Tj Tstg Symbol 3 2 0.50.08 0.40.04 emitter voltage 2SB0789A Emitter to base voltage Peak collector current Collector current Collector power dissipation Junction temperature Storage temperature V V A A W C C 45 3.00.15 1:Base 2:Collector 3:Emitter MiniP3-F1 Package Marking symbol : D(2SB0789) E(2SB0789A) * Printed circuit board: Copper foil area of 1cm2 or more, and the board thickness of 1.7mm for the collector portion s Electrical Characteristics Parameter Collector to emitter voltage 2SB0789 2SB0789A (Ta=25C) Symbol VCEO VEBO hFE1*2 hFE2 VBE(sat) fT Cob Conditions IC = -100A, IB = 0 IE = -10A, IC = 0 VCE = -10V, IC = -150mA VCE = -5V, IC = -500mA IC = -500mA, IB = -50mA IC = -500mA, IB = -50mA VCB = -10V, IE = 50mA, f = 200MHz VCB = -10V, IE = 0, f = 1MHz min -100 -120 -5 90 50 - 0.2 - 0.85 120 30 - 0.6 -1.2 V V MHz pF 220 typ max Unit V V Collector to base voltage Forward current transfer ratio *1 Collector to emitter saturation voltage *1 VCE(sat) Base to emitter saturation voltage *1 Transition frequency Collector output capacitance *1: Pulse measurement *2: hFE1 Rank classification Rank hFE1 Marking Symbol 2SB0789 2SB0789A Q 90 ~ 155 DQ EQ R 130 ~ 220 DR ER Note.) The Part numbers in the Parenthesis show conventional part number. SJC00056BED 0.4 max. 2.60.1 Publication date: August 2002 1 2SB0789, 2SB0789A PC -- Ta 1.4 IC -- VCE -1.2 Ta=25C -1.0 -18mA -16mA -14mA IB=-20mA -12mA -10mA - 0.8mA - 0.6mA - 0.4mA -1.0 -1.2 IC -- I B VCE=-10V Ta=25C Collector power dissipation PC (W) 1.2 Printed circut board: Copper foil area of 1cm2 or more, and the board thickness of 1.7mm for the collector portion. Collector current IC (A) 1.0 - 0.8 0.8 - 0.6 0.6 - 0.4 - 0.2mA 0.4 0.2 - 0.2 0 0 20 40 60 80 100 120 140 160 0 0 -2 -4 -6 -8 -10 -12 Collector current IC (A) - 0.8 - 0.6 - 0.4 - 0.2 0 0 -3 -6 -9 -12 -15 Ambient temperature Ta (C) Collector to emitter voltage VCE (V) Base current IB (mA) VCE(sat) -- IC Collector to emitter saturation voltage VCE(sat) (V) -100 -30 -10 -3 -1 VBE(sat) -- IC Base to emitter saturation voltage VBE(sat) (V) IC/IB=10 -100 -30 -10 -3 25C -1 Ta=-25C 75C IC/IB=10 600 hFE -- IC VCE=-10V Forward current transfer ratio hFE 500 400 - 0.3 - 0.1 Ta=75C 25C -25C 300 Ta=75C 200 25C -25C 100 - 0.3 - 0.1 - 0.03 - 0.01 - 0.01 - 0.03 - 0.1 - 0.3 - 0.03 - 0.01 - 0.01 - 0.03 - 0.1 - 0.3 -1 -3 -10 -1 -3 -10 0 - 0.01 - 0.03 - 0.1 - 0.3 -1 -3 -10 Collector current IC (A) Collector current IC (A) Collector current IC (A) fT -- IE 200 180 Cob -- VCB Collector output capacitance Cob (pF) VCB=-10V Ta=25C 50 45 40 35 30 25 20 15 10 5 0 -1 IE=0 f=1MHz Ta=25C Transition frequency fT (MHz) 160 140 120 100 80 60 40 20 0 1 3 10 30 100 -3 -10 -30 -100 Emitter current IE (mA) Collector to base voltage VCB (V) 2 SJC00056BED Request for your special attention and precautions in using the technical information and semiconductors described in this material (1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technologies described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuits examples of the products. It neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license. (3) We are not liable for the infringement of rights owned by a third party arising out of the use of the product or technologies as described in this material. (4) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: * Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. * Any applications other than the standard applications intended. (5) The products and product specifications described in this material are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) When using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd. 2002 JUL |
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